Industry Advisory Board
The Electrical Engineering and Computer Science Corporate Industry Board was formed in 2007 and is comprised of industry representatives from a variety of electrical engineering and communications technology companies. The board meets quarterly to advise and assist academic leadership on curriculum development, student internships and design review, and to serve as a liaison to local industry.
Other corporate affiliates can receive information about the department's focus areas through our major research centers such as the Integrated Nanosystems Research Facility, the Center for Pervasive Communications & Computing, the Center for Embedded Computer Systems, and the California Institute for Telecommunications and Information Technology. The EECS faculty members affiliated with these centers work closely with industry colleagues to develop new technologies in areas including nanotechnology, distributed computing and secure networks.
Current Members
Khaled AbouZeid
Jim Aralis
Microsemi Corporation
Thomas Badger
Verizon Wireless
Dean Badillo
Skyworks Solutions
Ed Barnes
Western Digital Corp.
David Baugh
Rockwell Collins
Stuart Berman
Chair
Brian Bennett
Manager, Chipset Development, Advanced Component Division, Intel Corporation
Donald Bollella
Attorney, Skyworks Solutions
William Boyle
Western Digital Corp.
Jun Cao
Principal Scientist, Broadcom Corporation
Ting Chan
Marvell
Elsa Chen
Product Staff Engineer, Skyworks Solutions, Inc.
Dooyoung Choi
Mentor Graphics
Ray Clancy
Test Engineering Manager, Broadcom Corporation
Dan Cregg
Insteon
Dave Crespi
Vice President, Technology, Emulex Corporation
Shafa Dahandeh
Western Digital Corporation
Geert de Veirman
Microsemi Corporation
George Eaton
Pete Fiacco
Sangram K. Gaikwad
Business Development Manager (Aerospace & Defense Segment), MathWorks
Oleksandr Goushcha
Chief Technology Officer, Array Optronix, Inc.
Mingying Gu
Western Digital
Jeffrey L. Hilbert
President, COO, and Founder, WiSpry, Inc.
Ying W. Hsu
Director, Advanced Concepts, Irvine Sensors Corporation
Brian Johnson
Western Digital
Charles J. Kim
Southern California Edison
Michael Klett
Western Digital Corp.
Garrett Lee
The Boeing Company
Jeff Ludwig
Anil S. Mankar
Senior VP, Core Engineering, Mindspeed Technologies, Inc.
Ken Neeld
Delphi Display Systems
Hoa Nguyen
OK International
Lyle Norton
Thales Group
George Papadopoulos
VP Engineering & Engineering Operations, 3D Advanced Technologies
Robert Peirson
Senior Director, RFS Product and Test Engineering, Skyworks Solutions, Inc.
Brad Potts
Mentor Graphics Corp.
Jacob Rael
Broadcom
Eric Raith
Conexant
Michael Rakijas
Senior Principal Systems Engineer, Thales Raytheon Systems
Dennis Richman
Technical Director and Engineering Fellow, Airborne Integrated Mission Systems, Raytheon Company
Darryl Sato
President, Beryl Technologies
Dan Schumann
Engineering Consultant, CareFusion
Neema Shafigh
Keysight Technologies
Shervin Shokooh
ETAP
Royce Slick
Canon
Ahmed Syed
Southern California Edison
Victor Tran
Truc Vu
Vice President, Wafer Fab Technology, Microsemi Corporation
Steve Way
Northrop Grumman
Christian Wiher
Broadcom
Maria Wong
Ametek
Jeffrey Yang
Joon You
Director, West Coast Operations, ISS
David Yound
Skyworks
Raymond Yu
Todd Zylman
Senior Staff - Mixed Signal and Power Products, Northrop Grumman Space Technology