RF-IC Challenges for the Next Generation of CDMA Mobile Phones
IEEE Solid-State Circuits Society
Los Angeles/Orange County Chapter
Featuring Charles J. Persico
Senior Vice President of Engineering
Location: McDonnell Douglas Engineering Auditorium, University of California, Irvine
Refreshments will be served at 4:30 p.m.
There are several challenges (and opportunities) in the future for integration, performance and cost for RFIC design in mobile handsets. The current level of integration relies on a total system solution to deliver cost effective and highly integrated chipset. The market needs on low end are for low cost to support emerging markets. On the mid and high end needs focus on size (sleek, stylish phones) and performance (data rates, battery life, roaming). In addition, handset manufacturers NRE and time to market pressures need to be addressed.
These market forces will require innovation in:
- passive component elimination (e.g., SAW filters)
- power reduction
- multimode-multiband, configurable radio's
- concurrent operation with other wireless peripherals
- mobile handset receive and transmit diversity
About the Speaker:
Charles J. Persico (S'85-M'91) Charles Persico was born in 1960 in Schenectady, NY. He received his B.S. from
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